Dr. Karmjit Singh Sandha
Assistant Professor

Designation:

Assistant Professor

Specialization:

VLSI Interconnects, MWCNT Based Interconnects, Optical Interconnects and Embedded Systems

Email:

kssandha@thapar.edu

Contact No.

+91-175-2393424, +91-9646-020-543

Subjects

Microprocessors and Microcontrollers, Microcontroller and embedded system, Electronics Engineering.

Membership of Professional Institutions, Associations, Societies

  • Lifetime member ISTE
  • IAENG

Publications and other Research Outputs

SCI/SSCI

  1. Karmjit Singh, Shairy Sharma, “Performance and Analysis of Different Mixed-MWCNT Structures as VLSI Interconnects for Nano-electronics IC Design’, Journal of Nanoelectronics and Optoelectronics, (Accepted).
  2. Prakhar Litori, Karmjit Singh Sandha and Ankush Kansal, “Impact of tunneling conductance on the performance of multi walled carbon nanotubes as VLSI interconnects for nano-scaled technology nodes,”Journals of Material Science:Materials in electronics, vol. 28,pp. 4818-4827,2017.
  3. Karmjit Singh, Balwinder Raj, “Performance analysis of temperature dependent Multi-walled Carbon Nanotubes as Global Interconnects at different technology nodes” Journal of Computational Electronics, Volume 14, Issue 2, pp 469-476, June 2015.
  4. Karmjit Singh, Balwinder Raj, “Influence of Temperature on MWCNT bundle, SWCNT bundle and Copper interconnects for Nanoscaled Technology nodes” Journal of Materials Science: Materials in Electronics. Volume 26, Issue 8, pp 6134-6142, August 2015.
  5. Karmjit Singh, Balwinder Raj, Temperature Dependent Modeling and Performance Evaluation of Multi-Walled CNT and Single-Walled CNT as Global Interconnects” Journal of Electronic Materials, Volume 44, Issue 12, pp 4825-4835.

Non-SCI

  1. Akshi; Sandha, Karamjit Singh, “Influence of Inter-Shell Distance on Propagation Delay and Power of Mwcnt Bundle at Local Interconnect,” Journal of Active & Passive Electronic Devices, Vol. 12 Issue 1/2, pp. 41-54. 14, 2017.
  2. Karmjit Singh, Balwinder Raj,” Comparison of Temperature Dependent Performance and Analysis of SWCNT bundle and Copper as VLSI Interconnects,” Research Cell: An International Journal of Engineering Sciences, Volume 17, Issue 1, pp 583-595, 2016.
  3. Harsimran Kaur, Karmjit Singh Sandha, “Effect of electric field on metallic SWCNT interconnects for nanoscale technologies,” Journal of Semiconductors DOI: 10.1088/1674 -4926/36/3/035001, Vol. 36, issue 3, pp 035001-7 (SCOPUS Indexed)

Description of Research Interests

VLSI Interconnects, MWCNT Based Interconnects, Optical Interconnects and Embedded Systems